Description
Features:
- Suitable for SOIC, CHIP, QFP, PLCC, BGA and temperature-sensitive components
- The airflow can be adjusted and temperature controlled easily
- Full intelligence self-detection functions on air gun and iron to provide safe operation mode
- Sensor on handle leads to operating mode (high temp) when picked up or to standby mode (low temp) when laid down
- Suitable for heating shrink, drying, lacquer removal, viscidity removal, ice-out, pre-heating and glue soldering
- Automatic cooling function prolongs the heater’s lifetime and protects the hot air gun effectively
- With short circuit, open circuit, over-temp and over-load protection
- Fit for heating shrink, drying, lacquer removal, viscidity removal, ice-out, pre-heating and glue solderin
- Power Voltage: 220V ,50/60Hz AC
- CE approved
Specification:
- Hot Air Gun Specifications:
- Power Consumption: 740W
- Air Flow Type: Brushless fan Gentle Wind
- Air Flow Volume: <=120 L/MIN.
- Temperature Range: 100℃ – 480oC
- Temperature Stability: ± 1℃
Soldering Iron Specifications:
- Power Consumption: 50W, 24V
- Iron: ESM design.
- Temperature Range: 200℃ – 480 ℃
- Temperature Stability: ±2℃
- Tip to Ground Voltage: <2mV
- Tip to Ground Impedance: <2 ohm
DC Power Supply Specifications:
- Output voltage: DC 0 ~ 15V
- Load Stability: <0.01±2mv
- Temperature Coefficient: <300ppm/℃
- Protection Current: 1A-3A(Optional)
- Ripple dB: <1mvrms (virtual value )
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